What is Design Linked Manufacturing (DLM)?
Design Linked Manufacturing (DLM) is Kankanal’s proprietary methodology that tightly integrates design, prototyping, compliance, and full-scale production into a unified process. This approach accelerates product development, reduces cost overheads, and ensures certification compliance without compromising speed or quality.
Our DLM Capabilities
Hardware Reference Designs
Access our industry-validated circuit and mechanical designs, optimized for manufacturability and performance.
Prototyping & Rapid Iteration
Use our agile testing lab and feedback loops to refine your devices before scaling to mass production.
Device Certification & Compliance
Navigate CE, FCC, BIS, and other compliance benchmarks confidently with our in-house testing frameworks.
White Label Manufacturing
Build under your brand using our high-volume, quality-controlled, ISO-compliant manufacturing units.
Integration with IoT Platforms
Seamless integration with edge-cloud platforms for predictive maintenance, telemetry, and OTA support.
How Our DLM Process Works
Concept & Requirements
Define the scope with technical feasibility and value proposition analysis.
Reference Design & Prototyping
Build quick-turn prototypes using reusable IP blocks.
Validation & Certification
Execute functional, thermal, EMI/EMC testing with pre-cert audit.
White Label Manufacturing
Deploy fully branded production with traceability and batch control.
Post-Manufacturing Support
Offer lifecycle analytics, updates, and maintenance agreements.
Why Choose Kankanal for DLM?
Integrated Expertise
Our experts bring decades of knowledge across SoC, embedded firmware, radio design, and cloud orchestration.
Faster Time-to-Market
Dramatically reduce development cycles with parallel certification, tooling, and logistics planning.
Cross-Industry Knowledge
Success stories in healthcare, agriculture, energy, retail, and consumer electronics validate our breadth.
Sustainable Innovation
We design for environmental longevity, using recyclable enclosures and energy-optimized firmware stacks.
Quality Assurance
Production backed by 3-tier QA, defect prediction via AI, and traceable repair workflows ensure top-tier reliability.